Semiconductor packaging is the unsung hero of modern electronics, playing a crucial role in ensuring the reliability and functionality of microchips.
Recent advancements in packaging technology have paved the way for smaller form factors, enhanced thermal performance, and increased durability.
From fan-out wafer-level packaging to 3D integrated circuits, the industry is witnessing a paradigm shift.
This article delves into the art and science behind semiconductor packaging, unraveling the mysteries that underpin the future of microelectronics.
